NSPE-HF Series
+105C Hybrid construction SMT Aluminum Electrolytic Capacitors, features increased capacitance per case size
www.NICcomp.com/series/NSPE-HF
NIC Components is pleased to announce the addition of NSPE-HF series, of surface mount aluminum electrolytic capacitors, to its growing family of hybrid construction capacitors. Hybrid capacitors incorporate the best elements of both solid polymer and liquid electrolyte construction to provide ultra-low ESR, high ripple current ratings, with low leakage current and superior stability over voltage and temperature. NSPE-HF series is AEC-Q200 qualified, for use in automotive applications, and is ideal for use as alternates to solid polymer, or MLCCs type capacitors in DC-DC, POL and other power management applications where high voltage and stability are required.
An advantage of NSPE-HF series, is use of improved aluminum foil technology, resulting in higher capacitance values, and reduced case sizes, with lifetime rating of 5,000 hours at +105degC (option for 10,000 hour rating; please contact NIC). The NSPE-HF series is rated for use over -55degC to +105degC, in capacitance values from 10uF to 470uF with ±20% (M) tolerance, and voltage ratings from 25VDC to 80VDC. The liquid electrolyte, used within NSPE-HF series, has the advantages of high surge voltage resistance, self-healing and open mode wear-out, as compared to solid construction tantalum and solid polymer type aluminum electrolytic capacitors.
Supplied in 6.3mm x 6.1mm to 10mm x 12.5mm case sizes (DØ x H), NSPE-HF series is compatible with Pb-free reflow soldering up to +260degC. Both RoHS and REACH compliant, NSPE-HF has unit pricing from $0.27 to $0.59, with lead times from 8 to 10 weeks. Please contact NIC today, for free evaluation samples and to review your application requirements.
NSPE-HF FEATURES & BENEFITS
Higher capacitance per case size
Reduced case size; PCB layout and unit cost savings
Stable ESR & Z over Temperature
Low ESR & High Ripple Current ratings
Reduce the number of components used
Reduce PCB size – costs and component placement costs
Low leakage current, upgrade over solid polymer type