General Information:

Test Conditions:

• General
• High Cap MLCCs

Aging Characteristics

Temperature Coefficients

Flammability

Voltage Coefficient

• NPO
• X7R
• Y5V

Capacitor Parameters:

• Dissipation Factor (DF), Loss Tangent (tanδ), Equivalent Series Resistance (ESR) and Quality Factor (Q)

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Voltage Coefficient Comparisons & Solutions

Review and comparison of typical voltage coefficient of High Capacitance value MLCCs (X7R, X5R & Y5V) capacitors as compare to electrolytic and film capacitors. 

• Capacitance value decrease, due to voltage coeffiicent, is often overlooked (or unknown) to circuit design engineers.
• This presentation illustrates the typical unstable voltage coefficient of X7R, X5R & Y5V MLCCs, as compared to stable voltage coefficient of Film capacitors and Electrolytic capacitors

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Piezoelectric Noise: MLCC Ringing ‐ Singing

Possible solutions for reducing or eliminating MLCC ringing – singing issues

• Modified PCB materials or layout
• Lower K Dielectric MLCCs
• SMT Film Capacitors

This presentation includes typical performance comparisons of ceramic MLCCs to SMT film capacitors covering; Voltage Coefficient, Temperature Coefficient, Leakage Current, Noise (distortion) & Dielectric Absorption 

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Surface Mount (SMT) Ceramic Chip Capacitor Product Specific Information:

• Measurement of High Capacitance MLCC
• MLCC - Voltage & Current Guideline
• Taping Specs
• Tape Packaging

Characteristics:

• ESD characteristics
• Solderability

PCB Soldering:

• Land Patterns
• Profiles
• Hand Soldering Guideline
• Soldering Conditions

Ceramic Chip Capacitors

• Failure Mode Study - Potential Failure Causes, Accelerators, Behaviors & Remedies

Component Cracking:

• Mechanical Flexure Cracking Guide
• NMC vs. NMC-P Series: PCB Flexure Comparison

Related Guidelines:

1. Alternates to SMT Tantalum Chip Capacitors
2. Component Cracking:  Mechanical Flexure Cracking Guideline  Leaded Product Specific Information

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Leaded Product Specific Information

Component Marking:

• NCD - Ceramic Disc
• NCM/NCMA - Multilayer

Taping Specs:

• NCD-Ceramic Disc
• NCM/NCMA-MLC

10KVDC & Higher VDC Rated Ceramic Disc Precautions and Handling Guideline

General Information:

Application - Characteristics Guides

• Typical Life vs Temperature
• Double Layer Capacitors Guideline

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Surface Mount (SMT) Product Specific Information:

• NEXC Performance Characteristics
• NEXC Discharge Curves
• NEXC Soldering & Reflow Profile

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LDD - Leaded Product Specific Information:

• NEXG Discharge Curves
• NEDZ / NEDZN Leakage CUrrent 72 Hours
• NEXT Temperature Characteristics 0.1F ~ 2.2F
• NEXT Capacitance & ESR Test
• NEXT 1Khz ESR)
• NEXM Performance Characteristics
• NEDL Reliability (FIT & MTTF
• Wave Soldering

General Information

Capacitor Parameters:

• Dissipation Factor (DF), Loss Tangent (tanδ), Equivalent Series Resistance (ESR) and Quality Factor (Q)

LDD - Leaded Product Information

• Precautions For Use Guide
• Taping Specs
• Component Marking

LDD - Performance Characteristics

• AC De-rating
• DV/DT Ratings
• ESR-Z Comparison
• Temperature & Frequency

PCB Soldering

• Profile 

General Information

• Test Conditions
• Flammability Characteristics
• Capacitor Parameters:
  
  • Dissipation Factor (DF), Loss Tangent (tanδ), Equivalent Series Resistance (ESR) and Quality Factor (Q)

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Surface Mount (SMT) Product Specific Information

NTC-T Series - Standard

• Component Marking
• Details: Construction - Structure
• Reliability - Failure Rate
• Voltage De-rating Guide
• Temperature Characteristics
• PCB Soldering: 
  
  • Land Patterns
    
  • Soldering Profiles
    
  • Hand Soldering Guideline
   

NTP Series - Polymer Cathode; Low ESR

• NTP Product Guideline
• Reliability / Environmental Test Data
• Voltage Derating (Alum & Tantalum E-Caps)
• PCB Soldering: 
  
  • Hand Soldering Guideline

Rated Guidelines

1. Alternates to SMT Tantalum Chip Capacitors
2. Using SMT Aluminum E-Cap on existing SMT Tantalum Chip E-Cap Land Pattern

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Leaded Product Specific Information

• NDTM Component Marking

Soldering:

• Leaded Soldering Profile

General Information

• Current sensing resistor pulse power withstanding comparison test
• Component Marking Guideline
• Bulk Cassette Cartridge
• Packaging Options
• RoHS Exemption 7(c)-I extension until 2024

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Surface Mount Constructions

Thick Film Constructions

• NRC / NRSN Series Reliability Report
• NRC Series Characteristics Test Data
• NRSN Series Characteristics Test Data
• Trim-able Versions (Special Order)
• Structure - Composition
• Pulsed Power Characteristic (Thick Film and MELF)
• Surface Temperature Rise (self-heating)
• Noise Level Characteristics
• Component Flammability 

Thin Film Constructions

• Characteristics Test Data
• E192 Resistance Values

PCB Soldering

• Reflow Soldering Profiles
• Hand Soldering Guideline
• NRC - Chips Land Patterns
• NRSN - Array Land Patterns

 

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Leaded Constructions

• Lead Wire Characteristics

Component Appearance & Marking

• Component Appearance
• Axial Component Color Coding

PCB Soldering

• Wave - Flow Soldering Profile