NEXM Series Page


Series Features  

  • TAPE AND REEL PACKAGING
  • SUITABLE FOR FLOW SOLDERING
  • UP TO 50?A DISCHARGE CURRENT
  • POWER BACK-UP FOR CMOS RAM
  • DOUBLE LAYER CONSTRUCTION
  • LEAD-FREE FINISH

 

Design-In Info

NEXM is a NIC Preferred Series available for new designs

View terms of use, before using this product.

Application Focus

  • Contact NIC for application info
Product Resource Center

Environmental Info

  • Moisture Sensitiity Level (MSL) - N/A
  • RoHS Compliant - Yes
  • China RoHS Compliant - Yes
  • EU REACH Compliant: Yes
  • Halogen Free: Please contact NIC