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Components tap WLAN chip sets
EE Times - September 04, 2003
Driven by suppliers of wireless-LAN chip sets, passive-component
manufacturers are developing innovative devices and technologies to
meet the requirements for high-performance characteristics such as
quality, or "Q," factor, equivalent-series resistance (ESR) and
small packaging in the WLAN.
Next-generation components for WLAN applications will most likely
come in the form of antennas, integrated passive devices and module
designs, many of them based on low-temperature co-fired ceramic (LTCC)
technology for high performance and small size.
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NIC Components' answer to a host of wireless applications is
its wide range of low-ESR and high-Q NPO ceramic chip capacitors.
Designed for high-speed, high-frequency applications such as
Bluetooth and WLAN products, the
NMC-L and
NMC-M chip capacitors
are available in a capacitance range of 0.5 to 150 pF.
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Company Contacts
NIC Components Corp.
www.niccomp.com
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