NIC Logo

Site Search:
     
 
Company
Locations & Company Contacts
Join Our Team
News and Media
Certifications
 
 
 
News and Media
Company Press
Images and Logos
NIC in the Media
Product-Market Updates
Product Press
Promotions & Ads
 
 
 
Products
Helpful
Samples / Inventory
Sales Channels
Company
 
 
 
 
 
 
(10/10/00, 2:55 p.m. EST)

SMT shift revs up for aluminum caps
By Gina Roos EE Times
http://www.eet.com/story/OEG20001010S0041 

Like their counterparts in film capacitors, suppliers of aluminum electrolytic capacitors are moving in a big way to surface-mount packaging technology. It's a move that vendors say will improve voltage ratings, equivalent series resistance (ESR), capacitance range and the operating-temperature performance of aluminum
electrolytics.

The transition to surface mount for aluminum electrolytic caps has heated up tremendously, said Rich Schuster, president of NIC Components Corp. (Melville, N.Y.). The market had been slow to accept surface-mount technology because of the high capacitance values and higher voltages involved with aluminum electrolytics, Schuster acknowledged. But, he added, it's only natural that OEMs want to switch all of their devices over to surface mount when possible to eliminate a soldering process.

A key reason why the electronics industry has not shifted as fast to surface-mount technology for aluminum electrolytic caps as it did for tantalum and ceramic capacitors is cost. Engineers can expect to pay 30 to 50 percent more for a surface-mount device (SMD) compared with a leaded part.

When SMD versions of aluminum electrolytic capacitors were first brought to the marketplace several years ago, the most compelling issue was survivability. On the technical side, the only drawback to using aluminum electrolytic capacitors is that they still have a relatively high profile compared with tantalum and ceramic caps. For that reason they aren't used in cell phones, PDAs or portable wireless products, said Schuster of NIC Components.

Another more recent challenge that engineers face is availability. Since interest in surface-mount aluminum electrolytic capacitors has started to pick up, manufacturers have limited production capacity. They are only just now gearing up production to meet demand. This has resulted in lead times as far out as 20 weeks. For instance, lead times for leaded aluminum electrolytics average six to eight weeks, compared with 20 weeks for some SMDs.  For many space-constrained applications, packing more capacitance or higher voltages in the same size package is a growing requirement. In response, cap makers are developing products with a wider capacitance range and higher voltage ratings.     

NIC can supply surface-mount aluminum electrolytic capacitors with a capacitance range of up to 6800uF. They are also available in low-ESR, low-leakage and extended-temperature ranges of up to 125 degrees C. The company says it has achieved higher performance ratings because of higher magnification foil and better production techniques.

NIC also offers its surface-mount product in 4-mm-high profiles. "We're getting much better volumetric efficiency so that we're able to put more capacitance into small packages," Schuster said. Most recently, NIC has introduced a larger aluminum electrolytic in a surface-mount configuration that offers a capacitance range as high as 6,800uF, and a high-voltage surface-mount aluminum electrolytic with voltage ratings up to 450 VDC, which can replace large-can, radial-leaded and possibly snap-in types.

Some suppliers-including BC Components, NIC and United Chemi-Con-are moving to polymer or solid-aluminum capacitors, which allows them to achieve lower ESR ratings as well as a smaller footprint. They are very popular for next-generation microprocessors, Schuster said, because they feature much longer life and better performance. Although they have been available for about four or five years, they've really taken off in the past two years, Schuster said. "The only drawback is limited production, but we're expanding production and coming out with a couple of new series over the next 30 to 60 days." The new radial-leaded and surface-mount solid-aluminum capacitors will feature low ESR, very low impedance and very high ripple current. "This will be the first time that we offer the technology in a radial-leaded configuration, which will allow for a wider range of capacitance and lower loss," Schuster said.

Innovation with older technologies is not lost on some aluminum electrolytic cap makers. They have beefed up their older axial-leaded aluminum electrolytic lines by offering a higher temperature range and low ESR/impedance. Axial-leaded devices offer low mounting heights that are desirable in automotive applications.

COMPANY CONTACTS

NIC Components Corp.
(631) 396-7500
www.niccomp.com
 
 
     

 

 

Quick Links:     Contacts  |  FAQs   |   Web Links   |   Series A~Z Contact Us