| Type |
Component Presentations |
LINK |
Hybrid Construction
[ PDF
LINK
]
Aluminum Electrolytic Capacitors
Hybrid Construction Advantages:
 Higher
voltage & temperature ratings than Solid Polymer
Version Alum E-caps
Low
ESR & High Ripple Current Ratings (RCR)
High
Voltage; 35V, 50V & 63VDC
Wide
Temperature -55C to +125°C
Extended
life: 10,000 hrs @ +105°C
Stability
at low temperature
High
Capacitance; up to 1000uF
Surge
& Transient Resistant
Open
mode failure & Wear-out
Reduces
number of components per PCB
 Comparison:
Hybrid Construction
to Liquid Construction
PDF
Performance
Comparison
|
 |
Extended Lifetime
Aluminum Electrolytic Capacitors
Longer
Life Applications – End Products
Component
Life Time Behavior
Review
of Life Time Ratings
Selection
Based upon Lifetime Ratings
Extended
Lifetime Products
+150°C
& +125°C Rated Products
Example
Application Review
Component
Technology Comparison
Competition
Cross-Reference
|
LINK |
LINK |
|
This PAPER
presented - published:
IPC/JEDEC
Conference
CARTS05 Europe
Passive Components Magazine
|
WHITE PAPER
HIGH TEMPERATURE REFLOW SOLDERING
SMT ALUMINUM ELECTROLYTIC CAPACITORS
|
|
|
|
Article: |
RoHS
makes impact on circuit design
Electronics Weekly - April 2007
RoHS compliance occupied many
employees in all sectors of the electronics industry for significant
amounts of time pre-July 2006. RoHS related activity continues post
implementation and there is a lot of fall-out from the legislation.
Away from RoHS, industry trends for next-generation systems continue
driving component and circuit design. Higher speeds,
low-voltage/high-current operation and greater component densities,
are just some of the factors testing the technical expertise and
capability of component manufacturers
PDF Version:
LINK |
|
 |
|
Article: |
|
INDUCTORS FEATURE :: October
2006
Trends Place Focus Upon Inductive Solutions
Passive Components Industry Magazine
Today’s low operating voltages and high data rates force circuit
designers to think deeper to safeguard noise performance. Rapidly
increasing component and interconnect density, bringing increased risk of
crosstalk, only adds to the challenges. At the same time, older
through-hole PCBs are continuing to transition to surface mount
technology. All of these individual trends are together driving up demand
for advanced, small-footprint, low-profile inductors in surface mount
packages. At the high signal speeds encountered in 3G or broadband
infrastructure products, residential gateways, PCs, multimedia phones and
advanced gaming terminals for example, filter designers ...
PDF Version: LINK |
|
|
|
PRODUCT
SELECTION
ALUMINUM ELECTROLYTIC CAPACITORS FOR LIGHTING
APPLICATIONS Guideline [17pgs -
3.8Mb] |
|
|
TECHNOLOGY FEATURE
HYBRID ELECTROLYTE Guideline [10pgs -
0.45Mb] |
|
|
Thick Film SMT Resistor Arrays:
Convex to Concave Style
Comparison Size: 0.19Mb |
|
|
Low ESR Electrolytic Capacitors Size:
0.53Mb |
|
|
Low ESR Electrolytic Capacitors Size:
0.90Mb |
|
|
Alternates
to Tantalum Chip Capacitors Size:
0.91Mb |
|
|
Low ESR capacitors for Low Voltage-High Current Designs Size:
0.88Mb |
|
|
Space Saving Solutions for High Density Designs Size: 1.19Mb |
