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Formats: = MS PowerPoint presentation  |   = Adobe PDF document 
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Type Company Presentation

NIC Company Profile [ Version] Size: 1.33Mb
Type Component Presentations
WHITE PAPER
HIGH TEMPERATURE REFLOW SOLDERING 
SMT ALUMINUM ELECTROLYTIC CAPACITORS
 

Robustness of Surface Mount Aluminum Electrolytic Capacitors When Subjected to Pb-Free Reflow (soldering)

Test Report

by CALCE, NIC Components
&
DFR Solutions

This PAPER presented - published:
 
  • IPC/JEDEC Conference April 2005
  • CARTS Europe; October 2005
  • Nov/Dec 2005 Issue: Passive Components Magazine 
  • A LOOK INSIDE:
    ... "The specific parameters chosen were based upon IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices (see Fig 1).  The peak temperatures chosen were +235degC & +260degC. These temperatures were based upon the minimum recommended reflow temperature for tin/silver/copper (SAC) solder alloys and the maximum expected peak temperature detailed by JSTD-020C" ... MORE

    TECHNOLOGY FEATURE
    HYBRID ELECTROLYTE Guideline [10pgs - 0.45Mb]
    Thick Film SMT Resistor Arrays:  
    Convex to Concave Style Comparison  Size: 0.19Mb
    Low ESR Electrolytic Capacitors  Size: 0.53Mb
    Low ESR Electrolytic Capacitors  Size: 0.90Mb

    Alternates to Tantalum Chip Capacitors  Size: 0.91Mb

    Low ESR capacitors for Low Voltage-High Current Designs  Size: 0.88Mb

    Space Saving Solutions for High Density Designs  Size: 1.19Mb

    Type Product Training Presentations

    Aluminum electrolytic capacitor product training  Size: 9.16Mb

    Ceramic capacitor product training  Size: 1.63Mb

    Passive Components  Size: 2.90Mb

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