NIC Logo

Live Help

Part Search Site Search
     
 
Environmental Support
Tech Support
Technical Information
Presentations
Web Links
Quick Lookup
Converters
FAQs
 
 
 
Products
Helpful
Samples / Inventory
Sales Channels
Company
 
 
 
 
 
Home > Helpful Information > Presentations
 
Cross Reference
 
 

Formats: = MS PowerPoint presentation  |   = Adobe PDF document 
To download, right click on below link & "save as"  

 
Type Company Presentation

NIC Company Profile [ PDF Version: LINK ] Size: 1.33Mb
Type Component Presentations


LINK
Hybrid Construction  [ PDF LINK ]
Aluminum Electrolytic Capacitors

Hybrid Construction Advantages:
Higher voltage & temperature ratings than Solid Polymer Version Alum E-caps
Low ESR & High Ripple Current Ratings (RCR)
High Voltage; 35V, 50V & 63VDC
Wide Temperature -55C to +125°C
Extended life: 10,000 hrs @ +105°C
Stability at low temperature
High Capacitance; up to 1000uF
Surge & Transient Resistant
Open mode failure & Wear-out
Reduces number of components per PCB

Comparison:
Hybrid Construction
to Liquid Construction

PDF
Performance
Comparison

 

Extended Lifetime
Aluminum Electrolytic Capacitors

Longer Life Applications – End Products
Component Life Time Behavior
Review of Life Time Ratings
Selection Based upon Lifetime Ratings
Extended Lifetime Products
+150°C & +125°C Rated Products
Example Application Review
Component Technology Comparison
Competition Cross-Reference
 
LINK LINK


 

This PAPER presented - published:

  • IPC/JEDEC Conference
  • CARTS05 Europe
  • Passive Components Magazine 
  • WHITE PAPER
    HIGH TEMPERATURE REFLOW SOLDERING 
    SMT ALUMINUM ELECTROLYTIC CAPACITORS
     

    Robustness of Surface Mount Aluminum Electrolytic Capacitors When Subjected to Pb-Free Reflow (soldering)

    Test Report

    by CALCE, NIC Components
    &
    DFR Solutions

    The specific parameters chosen were based upon IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices (see Fig 1).  The peak temperatures chosen were +235degC & +260degC. These temperatures were based upon the minimum recommended reflow temperature for tin/silver/copper (SAC) solder alloys and the maximum expected peak temperature detailed by JSTD-020C ...

    PDF Version:
    LINK

     

    Article:


    RoHS makes impact on circuit design
     Electronics Weekly
    - April 2007

     
    RoHS compliance occupied many employees in all sectors of the electronics industry for significant amounts of time pre-July 2006. RoHS related activity continues post implementation and there is a lot of fall-out from the legislation.
      Away from RoHS, industry trends for next-generation systems continue driving component and circuit design. Higher speeds, low-voltage/high-current operation and greater component densities, are just some of the factors testing the technical expertise and capability of component manufacturers

      PDF Version: LINK
    Article:

    INDUCTORS FEATURE ::  October 2006

    Trends Place Focus Upon Inductive Solutions

    Passive Components Industry Magazine

    Today’s low operating voltages and high data rates force circuit designers to think deeper to safeguard noise performance. Rapidly increasing component and interconnect density, bringing increased risk of crosstalk, only adds to the challenges. At the same time, older through-hole PCBs are continuing to transition to surface mount technology. All of these individual trends are together driving up demand for advanced, small-footprint, low-profile inductors in surface mount packages. At the high signal speeds encountered in 3G or broadband infrastructure products, residential gateways, PCs, multimedia phones and advanced gaming terminals for example, filter designers ...

    PDF Version: LINK

    PRODUCT SELECTION
    ALUMINUM ELECTROLYTIC CAPACITORS FOR LIGHTING APPLICATIONS Guideline [17pgs - 3.8Mb]
    TECHNOLOGY FEATURE
    HYBRID ELECTROLYTE Guideline [10pgs - 0.45Mb]
    Thick Film SMT Resistor Arrays:  
    Convex to Concave Style Comparison  Size: 0.19Mb
    Low ESR Electrolytic Capacitors  Size: 0.53Mb
    Low ESR Electrolytic Capacitors  Size: 0.90Mb

    Alternates to Tantalum Chip Capacitors  Size: 0.91Mb

    Low ESR capacitors for Low Voltage-High Current Designs  Size: 0.88Mb

    Space Saving Solutions for High Density Designs  Size: 1.19Mb

    Type Product Training Presentations

    Aluminum electrolytic capacitor product training  Size: 9.16Mb

    Ceramic capacitor product training  Size: 1.63Mb

    Passive Components  Size: 2.90Mb

    Quick Links:     Contacts  |  FAQs   |   Web Links   |   Series A~Z Contact Us

    Bookmark and Share