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| Type |
Component Presentations |
 NSPE-S
NSPE-H
NSPE-T
NSPE-U
NSPE-Y |
Hybrid Construction
[
LINK
]
Aluminum Electrolytic Capacitors
Hybrid Construction Advantages:
 Higher
voltage & temperature ratings than Solid Polymer
Version
Alum E-caps
Low
ESR & High Ripple Current Ratings (RCR)
High
Voltage; 35V, 40V, 50V, 63V, 80V & 100VDC
Wide
Temperature -55°C to +135°C
Extended
life: 10,000 hrs @ +105°C
Low
ESR - Z at low temperature (-55°C) [LINK]
High
Capacitance; up to 1000uF
Surge
& Transient Resistant
Open
mode failure & Wear-out
Reduces
number of components per PCB
 Comparison:
Hybrid Construction
to Liquid Construction
PDF
Performance
Comparison
|
|
Hybrid Capacitors
in Quick Kit
For
Immediate Shipment |
10µF 50V 80mΩ 840mA
22µF 63V 40mΩ 1560mA
33µF 63V 30mΩ 1260mA
33µF 16V 54mΩ 1130mA
47µF 35V 60mΩ 1300mA
47µF 25V 60mΩ 1270mA
100µF 16V 22mΩ 2290mA
100µF 35V 30mΩ 1260mA
100µF 16V 19mΩ 1850mA
100µF 35V 30mΩ 1010mA
150µF 16V 20mΩ 2920mA
150µF 35V 23mΩ 2470mA
220µF 10V 18mΩ 1680mA
220µF 6.3V 16mΩ 3150mA
330µF 10V 18mΩ 2800mA
470µF 6.3V 16mΩ 3150mA |
|
 |
Extended Lifetime
Aluminum Electrolytic Capacitors
Longer
Life Applications – End Products
Component
Life Time Behavior
Review
of Life Time Ratings
Selection
Based upon Lifetime Ratings
Extended
Lifetime Products
+150°C
& +125°C Rated Products
Example
Application Review
Component
Technology Comparison
Competition
Cross-Reference
|
|
LINK |
LINK |
|
 |
Double Layer
Capacitors
Guideline
...
PDF
 22 pg
Guideline
Selection
Guide
Construction
Precautions
for Use
Characteristics
Terms
Lifetime
Temperature
Characteristics
Circuit
use - Applications
Discharge
Characteristics |
|
|
This PAPER
presented - published:
IPC/JEDEC
Conference
CARTS05 Europe
Passive Components Magazine
|
WHITE PAPER
HIGH TEMPERATURE REFLOW SOLDERING
SMT ALUMINUM ELECTROLYTIC CAPACITORS
|
|
|
|
Article: |
RoHS
makes impact on circuit design
Electronics Weekly - April 2007
RoHS compliance occupied many
employees in all sectors of the electronics industry for significant
amounts of time pre-July 2006. RoHS related activity continues post
implementation and there is a lot of fall-out from the legislation.
Away from RoHS, industry trends for next-generation systems continue
driving component and circuit design. Higher speeds,
low-voltage/high-current operation and greater component densities,
are just some of the factors testing the technical expertise and
capability of component manufacturers
PDF Version:
LINK |
|
 |
|
Article: |
|
INDUCTORS FEATURE :: October
2006
Trends Place Focus Upon Inductive Solutions
Passive Components Industry Magazine
Today’s low operating voltages and high data rates force circuit
designers to think deeper to safeguard noise performance. Rapidly
increasing component and interconnect density, bringing increased risk of
crosstalk, only adds to the challenges. At the same time, older
through-hole PCBs are continuing to transition to surface mount
technology. All of these individual trends are together driving up demand
for advanced, small-footprint, low-profile inductors in surface mount
packages. At the high signal speeds encountered in 3G or broadband
infrastructure products, residential gateways, PCs, multimedia phones and
advanced gaming terminals for example, filter designers ...
PDF Version: LINK |
|
|
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PRODUCT
SELECTION
ALUMINUM ELECTROLYTIC CAPACITORS FOR LIGHTING
APPLICATIONS Guideline [17pgs -
3.8Mb] |
|
|
Thick Film SMT Resistor Arrays:
Convex to Concave Style
Comparison Size: 0.19Mb |
|
|
Low ESR Electrolytic Capacitors Size:
0.53Mb |
|
|
Low
ESR Electrolytic Capacitors Size: 0.90Mb |
|
|
Alternates
to Tantalum Chip Capacitors Size:
0.91Mb |
|
|
Low ESR capacitors for Low Voltage-High Current Designs Size:
0.88Mb |
|
|
Space Saving Solutions for High Density Designs Size: 1.19Mb |
