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Home > Resources

RoHS & Pb-Free Resources

Robustness of Surface Mount Aluminum Electrolytic Capacitors When Subjected to Pb-Free Reflow (soldering)

Test Report
by CALCE, NIC Components
& DFR Solutions

This WHITE PAPER presented - published:

[Also see Pb-Free Solder Alloys Table]

On-Line Resources:

Pb-Free Websites:
•	IPC Leadfree.org
•	Lead-Free.org - Soldering Technology Centre - Lead-free soldering technology and use of lead-free solders for electronics assembly
•	Kester Lead-Free Solutions
•	NPL: Electronics Interconnection Lead-free Solders UK's national standards laboratory
•	Ncel.net - State-by-state updates on e-waste legislation in the U.S.
•	Pb-free.com - Lead-free Questions, Answers, Resources
•	Pb-free.info - Provides a simplified interpretation of ROHS lead-free information
•	DCA/EPTAC Lead-Free Seminars
Key Organizations
•	ANSI - The American National Standards Institute
•	EIA - Electronic Industries Association (http://www.eia.org/ and http://www.jedec.org/)
•	EICTA - European Information, Communications and Consumer Electronics Industry Technology Association
•	European Commission (EC) Parent organization of WEEE Directive and EEE Directive.
•	European Power Supply Manufacturers Association (www.epsma.org)
•	HDP User Group, International, Inc.
•	JGPSSI - Japanese Green Procurement Supply Survey Initiative
•	JEITA - Japanese Electronics & Information Technology Industries Association
•	IEEE - The Institute of Electrical and Electronics Engineers
•	IPC - Association Connecting Electronics Industries
•	SMTA - The Surface Mount Technology Association
•	NCMS - National Center for Manufacturing Sciences
•	NEMI - National Electronics Manufacturing Initiative
•	PCIF - Printed Circuits Interconnection Federation
•	U.S. Environmental Protection Agency

Pb-Free Solder Alloys

[ Source: http://www.indium.com/documents/pds/97820.pdf ]

Acronym	Composition	Liquidus°C	Solidus °C	Comments
- - -	52In/48Sn	118	118	Lowest melting point solder that is feasible
Sn-Bi	58Bi/42Sn	138	138	Good thermal fatigue performance; established history
SAB	57Bi/42Sn/1Ag	140	139	The addition of Ag adds mechanical strength
- - -	77.2Sn/20In/2.8Ag	187	175	Not for use over 100°C due to In/Sn eutectic @ 118°C
- - -	86.9Sn/10In/3.1Ag	205	204	No In/Sn eutectic problem; potential use for flip-chip assembly
- - -	91.8Sn/3.4Ag/4.8Bi	213	211	PCB and component metallization must be Pb-free; Pb contamination will diminish joint strength
SAC	95.5Sn/3.8Ag/0.7Cu	220	217	Common Pb-free alloy
SAC	95.5Sn/4Ag/0.5Cu	220	217	Common Pb-free alloy
SAC	95.5Sn/3.9/Ag/0.6Cu	220	217	NEMI-promoted alloy
SAC305	96.5Sn/3.0Ag/0.5Cu	220	217	Referred to as the SAC305 alloy
Sn-Ag	96.5Sn/3.5Ag	221	221	Binary Sn/Ag eutectic alloy with history of use, marginal wetting
Sn-Cu	99.3Sn/0.7Cu	227	227	Inexpensive, possible use in wave soldering
- - -	95Sn/5Sb	240	235	Used in food equipment and refrigeration tubing. Good wettability and creep resistance
- - -	65Sn/25Ag/10Sb	233	233	Die-attach solder, very brittle
- - -	80Au/20Sn	280	280	Excellent mechanical strength and thermal fatigue resistance solder, used for soldering to Au