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Surface Mount Tantalum Electrolytic Chip Capacitors |
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Type |
Series |
Temperature |
Description | Capacitance Range | Voltage Rating |
Sizes (Metric / English) |
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NTC-T |
-55°C ~ +125°C derated above +85°C |
Standard MnO2 Cathode Tantalum Chip |
0.047uF ~ 680uF |
2.5VDC ~ 50VDC |
J
= 1608 / 0603 |
| NTC-L |
-55°C
~ +125°C derated above +85°C |
Low ESR MnO2 Cathode Tantalum Chip |
10uF ~ 470uF |
6.3VDC ~ 35VDC |
B = 3528 /
1411 C = 6032 / 2412 D = 7343 / 2916 |
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| NTP |
-55°C
~ +105°C derated above +85°C |
Polymer
Cathode Low ESR Tantalum Chip |
2.2uF ~ 680uF |
2.5VDC ~ 16VDC |
J = 1608 /
0603 P = 2012 / 0805 A = 3216 / 1206 A2 = 3216 / 1206 B = 3528 / 1411 B2 = 3528 / 1411 C = 6032 / 2412 V = 7343 / 2916 D = 7343 / 2916 |
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NTP (ER) Special Load Life Report |
-55°C
~ +125°C derated above +85°C |
Extended Temperature Polymer Cathode Low ESR Tantalum Chip |
100uF & 330uF |
6.3VDC & 10VDC |
D = 7343 / 2916 | |
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Radial Leaded Tantalum Electrolytic Capacitors |
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Type |
Series |
Temperature |
Description | Capacitance Range | Voltage Rating | Sizes |
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-55°C
~ +125°C |
Standard |
0.1uF ~ 330uF |
6.3~ 50VDC |
Diameters: 4.5mm ~ 10mm Lead Spacing: 2.5mm & 5.0mm |
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Test Conditions |
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Temperature Characteristics |
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Reflow Soldering Limits (SMT Versions) |
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Component Marking: |
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PCB Layout &
Reflow Soldering: Land Patterns | Reflow Soldering Limits |
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Reliability - Failure Rate |
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Wave Soldering (NDTM Series) |
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Component Construction - Structure: NTC Series - Standard Structure NTP Series - Polymer Cathode Structure |
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Cross Reference:
NTC Series - Standard General X-Ref NTP Series - Polymer Cathode X-Ref Guide |
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Flammability Characteristics |
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NTP (ER) Ext. Temp: Endurance Report |
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Guidelines:
1. Alternates to SMT Tantalum Chip Capacitors 2. Using SMT Aluminum E-Cap on existing SMT Tantalum Chip E-Cap Land Pattern |
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| RoHS |
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